Electronic Chemicals
IPA
B-FLUX 110
B-ABC 09
B-Flux 130 (Touch Up Flux)
EXPLANATION
B-Flux 130 (Touch Up/ rework ) is a rosin/resin free, Halide and Halogen free, , less solids, no-clean flux, with fine wetting properties, used for both Pb-free and Sn/Pb applications.
Formulated for wave and Selective soldering of through-hole, mixed technology, and surface mount assemblies. The flux produces a tack-free surface with high surface insulation resistance and truly little residue to interfere with electrical testing. The flux has been specifically formulated to resist degradation in surface insulation resistance and electro-migration, even in situations where the flux does not experience soldering temperatures and when heavy levels of flux have been applied. The residues are non-corrosive and do not cause “greening” when in contact with copper or copper-bearing alloys.
Particularly developed for touch-up/rework when supplied in a flux pen
Features:
- Good cosmetics,
- No need to clean.
- Non-hygroscopic.
- Tack-free and non-corrosive residues
- Will not cause “greening” on exposed copper/copper alloys
Benefits:
- Environmental friendly. Complies with halogen-free industry standards
- Produces highly reliable assemblies with excellent cosmetics and pin testability
- Highly through-hole penetration rate and uniform SMT pad coverage
Flux Application:
B-Flux 130 Can be applied by Foam, spray, Dipping and brushing application. Uniform coating of flux is required on the board to achieve good results. To meet electrical stability and consistent soldering performance, materials used shall comply with Ionic cleanliness.
OPERATING PARAMETER
Amount of Flux Applied | Single : 1,200 to 1,600 µg/in2 solids Dual : 1,400 to 2000 µg/in2 solids
|
Top-Side Preheat Temperature | 90 – 120°C |
Bottom side Preheat Temperature | 110 – 140°C |
Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 – 6 seconds
|
B-DRCP 100
EXPLANATION
B-DRCP 100 is a unique product for metals that gives you the complete
solutions to your dross problem. It is a crystalline white colour, easy-to-use
powder
APPLICATIONS
While handling this use protective gloves and safety goggles. Sprinkling uniformly on the surface of the molten solder bath. Mix the powder into the dross with some chopping action. Before removing the dross from the solder bath, when there is still some metallic pure solder in the dross, reduce it by mixing an additional quantity of Dross Reducer Powder and skimming off the contaminated materials. Reapplication may be necessary after several hours of operation if dross begins to build up. Test and field results shows you need 07 – 11 gm. for 250 kg solder pot of solder for 8 hours.
PHYSICAL AND CHEMICAL PROPERTIES
- Visual Appearance Crystal white powder
- Odor slightly Ammonia
- Specific gravity 198 typical
- Melting Point 30-50C
- Flash Point None
PACKAGING
Available in plastic jars of 1kg and Half kg.
HEALTH AND SAFETY
- Observe standard precautions while handling.
- Eye and skin protection must be provided. Avoid breathing of liquid.
- Use in well-ventilated areas, DO NOT SMOKE, and use solvent-resistant gloves.
- Flammable should keep away from sparks and open flames.
- Remove skin splashes immediately washing with soap and water.
- For detailed information refer to the Safety Data Sheet (MSDS) available on request.
B-ABC-09 (Aqua Based Cleaner)
EXPLANATION
B-ABC-09 elaborated to a specified degree to remove the no-clean and water-
soluble flux residues from Pb-free and Lead/Tin and Polychlorinated biphenyls are
organochlorine compounds with the formula C₁₂H₁₀₋ₓClₓ; they were once widely used
in the manufacture of carbonless copy paper, as heat transfer fluids, and as dielectric
and coolant fluids for electrical equipment
QUALITY AND ADVANTAGE
- Non tending to absorb moisture from the air and non-corrosive
- Tin, Copper, Gold, Cadmium, Zinc, Silver and Organic solderability preservative
- The Aquatic Based Cleaner & halogen-free" products are more environmentally friendly i,e Halogen and Halide – free
- Zero ion PCB and BCBA
- Highly Concentrated cleaner 1: 4.5 to 7 (Water) ratios can be mixed with DI or Reverse osmosis to get good results in manual, ultrasonic or conveyorized cleaning methods
- Tack-free, good cosmetics
- B-ABC-09 is perfect to use on the following metal surfaces, provided the surfaces are not heavily tarnished
PROPERTIES
| PROPERTIES | ||||
|---|---|---|---|---|
| Saleable/ Validity Period | 540 Days | |||
| Ph caps | 8.5 +/- 0.4 | |||
| Odour | Slightly Ammonia | |||
| Density | 0.995 g/cm3 at 25°C | |||
| Boiling point: | 95°C | |||
USAGE
This cleaner is easily dissolved in water. a preferably concentrated cleaner can be used in 1: 4 to 7 (Water) ratios for manual, ultrasonic, or conveyorized cleaning methods. Can go up to 25% of concentrated cleaner for strong residues, it is better to use Di ionized water in the final stage of cleaning to avoid ionic contamination
from normal Water and maintain the cleanliness level throughout the process concentrated cleaner can be added periodically to maintain the pH level 6 to 7.9
OUR PRODUCT ENCASING TYPE
Packaging is available in 5 and 20 Litres (HDPE White carboy Container)
HEALTH AND SAFETY
- Observe standard precautions while handling.
- Eye and skin protection must be provided. Avoid breathing of liquid.
- Use in well-ventilated areas, DO NOT SMOKE, and use solvent-resistant gloves.
- Flammable should keep away from sparks and open flames.
- Remove skin splashes immediately washing with soap and water.
- For detailed information refer to the Safety Data Sheet (MSDS) available on request.
B-Sol B 1000 (Cleaner)
EXPLANATION
B-Sol B 1000 is a highly pure solvent used for dissolving urethanes, Rosin, silicones, anhydride- cure epoxies. It contains a proprietary blend of ingredients that facilitate polymer removal. It can be used for non-cured conformal coating material cleaning applications. It removes effectively pre-cured residues and other contaminants in PCBA and conformal coating equipment and printed circuit boards during the assembly process
Features:
- B-Sol B 1000 was developed so that a non-hazardous (by U.S. Department of Transportation definition) product was available for removing amine-cured epoxies or polymers.
- B-Sol B 1000 use glycol ethers, petroleum distillates & natural terpenes
- B-Sol B 1000 does not contain phenol, chlorinated solvents, strong acids and bases
TECHNICAL DATA
Test | SPECIFIC PARAMETERS |
Appearance | Clear, Colourless Liquid |
Odur | Orange |
Molecular weight | 68.10 |
Boiling Point | 160 ֯ C |
Specific gravity @ 25°C | 0.90 to 0.93 |
Flash Point (Closed cup) | 148 ֯ C (Open Cup) |
Water Miscibility | Miscible Easily |
Saleable | 540 Days |
OUR PRODUCT ENCASING TYPE
Packaging is available in 5 and 20 Litres (HDPE White carboy Container)
HEALTH AND SAFETY
- Observe standard precautions while handling. Eye and skin protection must be provided. Avoid breathing of liquid.
- Use in well-ventilated areas, DO NOT SMOKE, and use solvent-resistant gloves.
- Flammable should keep away from sparks and open flames.
- Remove skin splashes immediately by washing with soap and water.
- For detailed information refer to the Safety Data Sheet (MSDS) available on request.
B-Flux 120 (Halide Flux)
EXPLANATION
B-Flux 120 (Halide Free) is a Halide Free No clean flux, with fine wetting properties,
used for both Pb free and Sn/Pb soldering applications. Specifically developed to
deliver high reliability and excellent soldering performance combined with
outstanding board cosmetics and pin-testability
Features:
- Halide free, which is environment friendly,
- Fine soldering in both wave soldering processes.
- Low tendency.
- Good cosmetics
- Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver
Benefits:
- Environmental friendly. Complies with halogen-free industries standards
- Produces highly reliable assemblies with excellent cosmetics and pin testability
- High through-hole penetration rate and uniform SMT pad coverage
Flux Application:
B-Flux 120 can be applied by Foam, spray, Dipping, or brushing. To achieve good
results, a uniform coating of flux is required on the board. Materials used shall
comply with ionic cleanliness to meet electrical stability and consistent soldering
performance.
OPERATING PARAMETER
| Amount of Flux Applied | Single : 1,200 to 1,600 µg/in2 solids Dual : 1,400 to 1850 µg/in2 solids |
| Top-Side Preheat Temperature | 90 – 120°C |
| Bottom side Preheat Temperature | 110 – 140°C |
| Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 – 6 seconds |
| Solder Pot Temperature | 245-255°C for 63/37, 255-265°C for Lead Free SAC alloys |
TECHNICAL DATA
| Test | SPECIFIC PARAMETERS |
| Appearance | Clear, Colourless Liquid |
| Solids Content, wt/wt | 2.0% +/- 0.1 |
| IPC-J-STD-0004 Designation | ORLO |
| Acid Number mg KOH/g | 23.5 +/- 0.5 |
| Specific gravity @ 25°C | 0.794 +/- 0.01 |
| Flash Point | 15 ֯ C |
| IPC J-STD-004 Comb- UP and Down un-Cleaned | Meets IPC, JIS for corrosion and Copper mirror tests, Bellcore Surface Insulation Resistance and Electro Migration requirements |
| Saleable | 540 Days |
RESIDUE REMOVAL
B-Flux 120 (Hallide) is a no-clean board; flux residues are designed to be left on the
board. If desired, Flux residues can be removed with a water-based cleaner i,e, B-
ABC-09, solvent-based cleaners i.e B-E Friendly 100 DL, B-Cleaner 250, or IPA
Electronic Grade.
OUR PRODUCT ENCASING TYPE
Packaging is available in 5 and 20 Litres (HDPE White carboy Container)
HEALTH AND SAF ETY
- Observe standard precautions while handling.
- Eye and skin protection must be provided. Avoid breathing of liquid.
- Use in well-ventilated areas, DO NOT SMOKE, and use solvent-resistant gloves.
- Flammable should keep away from sparks and open flames.
- Remove skin splashes immediately washing with soap and water.
- For detailed information refer to the Safety Data Sheet (MSDS) available on request.
IPA ELECTRONIC GRADE
EXPLANATION
IPA ELECTRONIC GRADE is a highly pure material with Lime flavour that can be used for cleaning applications. This is an ideal replacement for hand wipes or immersion mineral spirits. It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants
Features:
- Pb free and meets other regulatory requirements.
- Having higher flash point and operator comfort with Lemon odour.
- An alternative to an aqueous cleaning system and cost-effective and meets ionic cleanliness standards.
- IPA E- Clean is suitable for use on the following metal surface, provided the surfaces are not heavily tarnished.
- Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver.
APPLICATION
IPA Electronic Grade is easy to handle and use in printing equipment and stencils on-board. Can be applied by spraying, Dipping and brushing
TECHNICAL DATA
Test | SPECIFIC PARAMETERS |
Appearance | Clear, Colourless Liquid |
Odur | Lemon |
Molecular weight | 60.10 |
Boiling Point | 82 ֯ C |
Specific gravity @ 25°C | 0.781 to 0.784 |
Flash Point (Closed cup) | 18 ֯ C |
Water Miscibility | Miscible Easily |
Saleable | 540 Days |
Purity | 99.9% |
Viscosity @ 20 | C2.3 cP |
Water | 0.1% Max |
Acidity | 0.03% Max |
Aldehydes & Ketones | 0.05% Max |
Evaporate Ratio | 1.7 (Butyl Acetate =1) |
TLV | 980mg/m3 (TWA), 1225mg/m3 (STEL) |
B-Flux 110 (No Clean Flux)
EXPLANATION
B-Flux 110 (No Clean Flux) is a halide-free (Wave Flux), with well-wetting properties, used for both Lead-free and Tin/Lead soldering applications. It is Widely used in the electronics manufacturing industry, especially in automotive applications and consumer electronics applications, B-Flux 110 (No-Clean/Wave Solder Flux) is a high-performance no-clean flux designed for wave soldering. It can be applied by foam or spray methods, it has a solids content of 4.0%, and contains a small amount of rosin leaving only a low level of non-tacky residue after soldering
Features:
- Halogen-free • Unique activator / package
- Compliant to GR-78-CORE (Telcordia/Bellcore)
- Low surface tension • Thermally stable
- Tack-free residue
Benefits:
- Environmental friendly. Complies with halogen-free industry standards
- Produces highly reliable assemblies with excellent cosmetics and pin testability
- High through hole penetration rate and uniform SMT pad coverage
Flux Application:
B-Flux 110 can be applied by spray, foam or wave application. A uniform coating of flux is essential to successful soldering. When applying flux, it is important to run a series of tests to ensure that the flux is being applied uniformly, that it is penetrating from top to bottom of the board on all holes to be soldered and to make sure that excessive amounts of flux are not being applied.
OPERATING PARAMETER
Amount of Flux Applied | Single : 1,200 to 1,600 µg/in2 solids Dual : 1,400 to 2,000 µg/in2 solids
|
Top-Side Preheat Temperature | 85 – 120°C |
Bottom side Preheat Temperature | 100 – 140°C |
Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 – 6 seconds
|
Maximum Ramp Rate of Topside Temperature (to avoid component damage) | 3°C/second (35°F/second) maximum |
B-BGA 100 PASTE FLUX
ILLUSTARTION
This No-Clean flux is engineered to be used in the placement and reflow of lead-free
solders for BGA attach processes. Before reflow, the flux provides sufficient tack to
hold the BGA in place. After reflow the residue is clear, Off white. This paste flux can
also be used in the rework of components
APPLICATIONS
The flux may be applied by Brush, screen printing, pin transfer or doctor blade / dip
coating methods.
Cleaning
Although the Flux is designed as a no-clean flux, the reflowed residue may be
cleaned with a B-E Friendly 100 DL Cleaner. Production stencils or pin transfer
equipment can be cleaned with B-E Friendly 100 DL Cleaner or B-ABC-09 Aquatic-
based cleaner.
STORAGE
The flux should be stored in sealed containers and can be stored at room
temperature up to 25°C (77 °F) for up to 12 months. If the material has been
refrigerated ( stored @ 0 to 10 °C or 32 to 50 °F) then the container should be
allowed to reach room temperature before opening to prevent moisture condensation
from ambient air on the flux
Reflow
Reflow can be accomplished in dry air or nitrogen-controlled atmosphere.
The initial ramp rate should be 1 to 2 °C per second. If necessary, a dwell of
1 to 2 minutes at 130 to 160 °C is acceptable. Following this equilibrating
period is a ramp of 60 to 120°C to a peak temperature of 235 to 260 °C
depending upon alloy. The time above alloy liquidus (TAL) should be 45 to
90 seconds. Cooling rate should be 3 to 7 °C per second to room
temperature.
PHYSICAL, CHEMICAL and ELECTRICAL PROPERTIES
- Appearance – Smooth, white to off-white paste
- Viscosity (Spiral/Malcom) – Typically 170 300 Poise @ 25°C (5 RPM)
- Tack strength – (As per IPC J-STD-004)
- Initial – 6.5 grams / sq mm
- 24 hr @ 50% – RH 6.2 grams / sq mm
- Fineness of Grind – < 10 μm
- Acid Number (mg KOH/g) – 130 168
- Corrosivity Passes – IPC Cu mirror, Cu corrosion
- Halide – Content Halide free (ROL-0 per IPC J-STD-004)
- J-STD-004 – SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned
- BELLCORE – SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned
- Electromigration (500 hours) – 1.6 x 1011 Ohms, 96 hours
PACKAGING
Available in plastic jars of 500 gm and 100 gm.
HEALTH AND SAFETY
- Observe standard precautions while handling.
- Eye and skin protection must be provided. Avoid breathing of liquid.
- Use in well-ventilated areas, DO NOT SMOKE, and use solvent-resistant gloves.
- Flammable should keep away from sparks and open flames.
- Remove skin splashes immediately washing with soap and water.
- For detailed information refer to the Safety Data Sheet (MSDS) available on request.